Cheolho Kim 等用光刻技术成功制备出B掺杂的3D多孔碳材料，并应用于微型超级电容器。性能测试表明，其容量可达7.15 mF/cm²，且电容保持率为80%。体积能量密度为7.1 mWh/cm³，体积功率密度为66 W/cm³。

Cheolho Kim, DayoungKang, Jun HyukMoon*. Full Lithographic Fabrication of Boron-doped 3D Porous Carbon Patterns for High Volumetric Energy Density Microsupercapacitors[J]. Nano Energy. 2018

DOI: 10.1016/j.nanoen.2018.08.044

下载链接：https://doi.org/10.1016/j.nanoen.2018.08.044